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HTC Diamond Grinding Segement

/EZ Change Wing HTC Grinding PCD Segment Floor Grinder Remove Glue Coating

EZ Change Wing HTC Grinding PCD Segment Floor Grinder Remove Glue Coating


  • Brand:

    SANG
  • Item No.:

    HTC BH
  • Payment:

    100%TT
  • Product origin:

    Fujian,China
  • Color:

    As request
  • Shipping port:

    Xiamen or Guangzhou
  • Lead Time:

    15days
  • Product Details

grinding material:Carpet glue,Thick epoxy(1-3mm),Thick levelling compound(1-3mm),Thick paint(1-3mm);

High performance for professional applications with bush hammer roller

Designed specifically for removing any elastic contaminants such as glue or coatings. 

 EZ change HTC pad

Item No Segment Type Grit Bond Segment size(mm) Segments No
S3-S Straight 6#,16#,30#,
35#~120#
Ex-soft/
Soft/
Medium/
Hard/
Ex-Hard
40*12*12H 1,2
S3-H Hexagonal / 1,2
S3-R Round φ25*15H 1,2,3,4,5
S3-A Arrow 20/13.5*15*10H 1,2
Material  Diamond + Metal powder
Certificate ISO9001,SGS
Size  40*10*10mm,40*10*12mm,40*12*12mm,customized available.
Shape Customized. according to the machine.
Grit 6-400#,customized.
Machine Lavina,Husqvarna,Klindex,HTC,and so on.
Usage concrete or floor grinding.
More detail please contact us.

 More details contact Allen

 whatsapp/wechat/Skype0086-15906067857 

tools@sangtools.com


       


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